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Electronics Assembly - Cari Data Buku

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Electronics Assembly - Cari Data Buku

 

Author(s)    Title    Publisher    Year


A. G. Davies, A. G. Davies, J. M. T. Thompson    Royal Society Series on Advances in Science    Imperial College Press    2007
    Advances in Nanoengineering: Electronics, Materials and Assembly (Royal Society Series on Advances in Science) [illustrated edition]       
    9781860947513, 1860947514       
Muhammad Ali Mazidi, Sarmad Naimi, Sepehr Naimi    AVR Microcontroller and Embedded Systems: Using Assembly and C (Pearson Custom Electronics Technology) [1 ed.]    Prentice Hall    2010
    0138003319, 9780138003319       
Elissa M. Bumiller, David A. Douthit, Joan Pecht    Electronic Packaging    CRC Press    2002
    Contamination of Electronic Assemblies [1 ed.]       
    849314836       
Roel Gronheid, Paul Nealey    Woodhead Publishing Series in Electronic and Optical Materials    Woodhead Publishing    2015
    Directed Self-assembly of Block Co-polymers for Nano-manufacturing [1 ed.]       
    0081002505, 9780081002506       
EriC. Harkness (Auth.)    European Contract Electronics Assembly Industry–1993–97. A Strategic Study of the European CEM Industry [1st ed.]    Reed Electronic Research    1993
    978-1-85617-177-9       
G. W. A. Dummer and J. Mackenzie Robertson (Eds.)    European Miniature Electronic Components and Assemblies Data 1965–66: Including Six-Language Glossaries of Electronic Component and Microelectronics Terms. France, Netherlands, Scandinavia and Switzerland    Elsevier    1965
    978-0-08-011151-3       
G. W. A. Dummer and J. Mackenzie Robertson (Eds.)    French Miniature Electronic Components and Assemblies Data 1967–68        1967
    978-1-4831-6813-5       
Mohamed Henini    Handbook of Self Assembled Semiconductor Nanostructures for Novel Devices in Photonics and Electronics [illustrated edition]    Elsevier Science    2008
    9780080463254, 0080463258       
Mohamed Henini    Handbook of Self Assembled Semiconductor Nanostructures for Novel Devices in Photonics and Electronics [illustrated edition]    Elsevier Science    2008
    9780080463254, 0080463258       
    IEC 61192-1 Ed. 1.0 b:2003 = Workmanship requirements for soldered electronic assemblies - Part 1: General        2/20/2003
    978-2-83-186843-1;2-83-186843-2       
    IPC EIA J-STD-001C - Requirements for Soldered Electrical and Electronic Assemblies       
Brian Jepson, Tyler Moskowite, and Gregory Hayes    Learn to Solder Tools and Techniques for Assembling Electronics    O'Reilly Media    2012
    978-1449337247       
Brian Jepson, Tyler Moskowite, Gregory Hayes    Learn to Solder: Tools and Techniques for Assembling Electronics    O'Reilly Media    2012
    1449337244, 9781449337247       
Brian Jepson, Tyler Moskowite, Gregory Hayes    Learn to Solder: Tools and Techniques for Assembling Electronics    O'Reilly Media    2012
    1449337244, 9781449337247       
Brian Jepson, Tyler Moskowite, Gregory Hayes    Learn to Solder: Tools and Techniques for Assembling Electronics    O'Reilly Media    2012
    1449337244, 9781449337247       
Keith Brindley (Auth.)    Newnes Electronics Assembly Handbook    Butterworth-Heinemann    1990
    978-0-434-90203-3       
Keith Brindley (Eds.)    Newnes Electronics Assembly Pocket Book    Newnes    1991
    978-0-7506-0222-8       
Yong Liu (auth.)    Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling [1 ed.]    Springer-Verlag New York    2012
    9781461410539, 1461410533       
Raghbir Singh Khandpur    McGraw Hill professional.; McGraw-Hill electronic engineering series    McGraw-Hill    2006
    Printed circuit boards : design, fabrication, assembly and testing       
    9780071589253, 0071589252, 9780071464208, 0071464204       
R. Khandpur    McGraw-Hill Electronic Engineering    McGraw-Hill Professional    2005
    Printed Circuit Boards: Design, Fabrication, and Assembly [1 ed.]       
    0071464204, 9780071464208, 9780071589253       
E-H Wong, Y.-W. Mai    Woodhead Publishing Series in Electronic and Optical Materials    Woodhead Publishing    2015
    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture [1 ed.]       
    1845695283, 9781845695286       
E-H Wong, Y.-W. Mai    Woodhead Publishing Series in Electronic and Optical Materials    Woodhead Publishing    2015
    Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture [1 ed.]       
    1845695283, 9781845695286       
Jennie S. Hwang Ph.D. (auth.)    Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly [1 ed.]    Springer US    1992
    978-0-442-01353-0, 978-1-4615-3528-7       
Jennie S. Hwang Ph. D. (auth.)    Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly [1 ed.]    Springer Netherlands    1989
    978-94-011-6052-0, 978-94-011-6050-6       
MIKE JUDD, Keith Brindley    Soldering in electronics assembly [2nd ed]    Newnes    1999
    0750635452, 9780750635455       
Mike Judd, Keith Brindley    Soldering in Electronics Assembly [2 ed.]        1999
    0750635452, 9780750635455, 9780080517346       
Mike Judd and Keith Brindley (Auth.)    Soldering in Electronics Assembly    Butterworth-Heinemann    1992
    978-0-7506-0589-2       
    Soldering of Electrical and Electronic Assemblies MIL-HDBK-2000 US DOD        1990
Frank Riley (auth.), Frank Riley (eds.)    The Electronics Assembly Handbook [1 ed.]    Springer-Verlag Berlin Heidelberg    1988
    978-3-662-13163-3, 978-3-662-13161-9       
Joachim Frank    Three-Dimensional Electron Microscopy of Macromolecular Assemblies [1 ed.]    Academic Press    1996
    0122650409, 9780122650406, 9780080525815       
JOACHIM FRANK    Three-dimensional Electron Microscopy Of Macromolecular Assemblies [1 ed.]        1996
    0122650409, 9780122650406, 9780080525815       
Joachim Frank    Three-Dimensional Electron Microscopy of Macromolecular Assemblies Visualization of Biological Mo [2 ed.]    Oxford University Press, USA    2006
    0195182189, 9780195182187, 0195150961, 9780195150964, 9781429415217       
Joachim Frank    Three-dimensional electron microscopy of macromolecular assemblies: Visualization of biological molecules [2 ed.]    Oxford University Press, USA    2006
    0195182189, 9780195182187, 0195150961, 9780195150964, 9781429415217       
Joachim Frank    Three-Dimensional Electron Microscopy of Macromolecular Assemblies: Visualization of Biological Molecules in Their Native State [2 ed.]    Oxford University Press, USA    2006
    9780195182187, 0195150961, 0195182189       

 
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Article details
Article ID: 918
Category: Technology
Date added: 2017-03-21 20:05:38
Views: 34
Rating (Votes): Article rated 5.0/5.0 (3)

 
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